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[Seminar] Hardware/Software Co-design for AI Systems

Source:     Publish Date:2020-10-15     Page Views:

Title:Hardware/Software Co-design for AI Systems

SpeakerProfChen Yiran

                  Duke University

HostProf. Yang Yuchao

Date & Time2020/10/18 09:30 - 10:30

Zoom:827 877 80973


Abstract:   

The rapid growth of modern neural network (NN) models’ scale generates ever-increasing demands for high computing power of artificial intelligence (AI) systems. Many specialized computing devices have been also deployed in the AI systems, forming a truly application-driven heterogenous computing platform. In this talk, we discuss the importance of hardware/software co-design in AI system designs. We first use resistive memory based NN accelerators to illustrate the design philosophy of AI computing systems, and then present several hardware friendly NN model compression techniques. We also extend our discussions to distributed systems and briefly introduce the automation of co-design flow, e.g., neural architecture search.


Biography:

Yiran Chen received B.S and M.S. from Tsinghua University and Ph.D. from Purdue University in 2005. After five years in industry, he joined University of Pittsburgh in 2010 as Assistant Professor and then promoted to Associate Professor with tenure in 2014, held Bicentennial Alumni Faculty Fellow. He now is the Professor of the Department of Electrical and Computer Engineering at Duke University and serving as the director of NSF Industry–University Cooperative Research Center (IUCRC) for Alternative Sustainable and Intelligent Computing (ASIC) and co-director of Duke University Center for Computational Evolutionary Intelligence (CEI), focusing on the research of new memory and storage systems, machine learning and neuromorphic computing, and mobile computing systems. Dr. Chen has published one book and more than 400 technical publications and has been granted 96 US patents. He serves or served the associate editor of several IEEE and ACM transactions/journals and served on the technical and organization committees of more than 50 international conferences. He is now serving as the Editor-in-Chief of IEEE Circuits and Systems Magazine. He received 7 best paper awards, 1 best poster award, and 15 best paper nominations from international conferences and workshops. He is the recipient of NSF CAREER award, ACM SIGDA outstanding new faculty award, the Humboldt Research Fellowship for Experienced Researchers, and the IEEE SYSC/CEDA TCCPS Mid-Career Award. He is the Fellow of IEEE, Distinguished Member of ACM, and a distinguished lecturer of IEEE CEDA.

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